Semiconductor Manufacturing Process Overview: Plasma, Thermal & Wet Processes
Synergistic process technologies that have some of the most demanding environments for elastomer materials are etch, ash/strip, deposition, thermal and plasma processing.
They are frequently confronted throughout the manufacture of:
- Flat Panel Displays (FPD)
- Solar Cells (Concentrator, Multi-Crystalline, Crystalline)
- Logic and memory
- Photovoltaic cells
- Power devices
Semiconductor Manufacturing Processes include:
- Plasma Process
- Wet Process
- Thermal Process
We supply cleanroom produced seals with low particle and low trace metal contamination for reduced output loss and low chemical abrasion rates that present the following advantages:
- Reduced mechanical clean or wet clean frequency
- Prolonged system up-time
- Reduced Cost of Ownership (CoO) through minimised Cost of Consumables (CoC)
- Greater Mean Time Between Failure (MTBF)
Recommendation for elastomer material is dependent on temperature, vicinity to the surface, process chemistry, technology mode, particular hardware location and equipment type being manufactured. We offer a broad scope of Perfluoroelastomer (FFKM) materials including Perlast®, Simriz™, Elast-O-Lion®, Parofluor®, Kalrez®, Chemraz®, Isolast®, Kaflon™ and Valqua (Armor, Fluoritz). We are able to knowledgeably match the ideal material for the end-user product complexity, process type, and system location.
Our product range for Semiconductor includes Slit Valve Doors, End-effector Pads, O Rings, KF/ISO/NW fittings and Custom Elements.
E & OE. M Barnwell Services endeavour to make sure that all content is correct. The information has been gathered from manufacturing partners.