Delivering Fluid Sealing Solutions Since 1972

Sealing products for the Semiconductor Industry

Sealing products for the Semiconductor manufacturing industry

M Barnwell Services offers an extensive range of Semiconductor Seals that can operate in deposition, etch, ash/strip, plasma, wet chemical and thermal processes. These products can be used within the semiconductor and related manufacturing industries:

  • Logic and memory
  • MEMS
  • Power Devices
  • Solar cells (crystalline, multi-crystalline, concentrator)
  • Flat-panel display
  • Optoelectronics

We work alongside the industries best so that there is a continuous development program that provides elastomers that not only keep pace with the current requirements of the industry, but also looks towards the future. The advantages of using M Barnwell Services’ semiconductor elastomer materials include:

  • Extended tool preventative
  • Maintenance (PM) cycles
  • Reduced process defects
  • Lower particle generation
  • Increased tool efficiency
  • Reduced cost of ownership

Sealing Products in Semiconductor

Semiconductor O Rings

Sealing products for the Semiconductor

Fully moulded Imperial and Metric O Rings. Manufactured to any size, ranging from 0.030″ to 96″ (0.8mm to 2.4m) internal diameter and 0.030″ to 0.470 (0.8mm to 12mm) cross section. Custom non-standard sizes are also available, which in turn makes them suitable for virtually any application. For more information on our range of O Rings, click here. For specific compounds, see FFKM O Rings, FKM/FPM O Rings, NBR O Rings.

Centering Rings

Sealing products for the Semiconductor

KF – ISO – NW Flange Fittings (Centering Rings) are used to centre and seal two flanges, in standard NW, KF and ISO sizes. They provide reliable vacuum seals within Semiconductor environments. Our range includes aluminium and stainless-steel centering rings that can be combined with O Ring materials frequently used in semiconductor wafer processing systems.

Slit Valve Doors

slit valve doors

Slit Valve Doors (SVDs) are a core component of various semiconductor process tools. They create a barrier between hostile process environments and the more mild areas of the equipment. Demands for ultra-purity and plasma resistance have resulted in the development of specific compounds for the Semiconductor industry. These materials offer supreme performance in sealing those applications. We offer a range of materials and profiles that maximise sealing integrity and life expectancy for bonded and non-bonded slit valve doors and MONOVAT® gates. These are available in many designs and sizes for 150mm, 200mm, 300mm and 450mm process equipment.

End Effector Pads / Wafer Handling Components

Sealing products for the Semiconductor

Wafer handling components using advanced dissipative elastomers to reduce electrostatic discharge damage. Our range of Dissipative End Effector Pads are specifically designed for use in Semiconductor manufacturing applications. These compounds are free from any metal components (nor metallic based fillers) and other incompatible and undesirable elements that can cause contamination or change in device characteristics. Semiconductor wafers and processes contribute to forming charge imbalances. Electrostatic discharge (ESD) is the main element in equipment failure. Particularly in smaller feature sizes with greater potential for ESD to cause immediate catastrophic failure or partially damaged devices. Our range of materials offers both, low and high coefficients of friction to allow tailoring of wafer retention force. Custom designs of end effector pads are also available.

Lip Seals

Lip seals provide sealing of wider gaps that require large amounts of deflection where limited contact force is available. For more information, see our Lip Seals page.

Micro Seals

Sealing products for the Semiconductor

Micro Seals are micro sizes rubber components that demand the highest degree of precision and quality to tackle the industry’s most critical applications, including those of Semiconductor. Our range is engineered and customised for your micro component requirements: designed and developed to thoroughly optimize your device or application. Micro Seal elastomer materials are certified compliant with FDA, USP Class VI, 3A 18-03, WRAS, and EC1935-2004. High-temperature capability up to +327°C and low-temperature capability down to -60°C. Virtually universal chemical resistance (FFKM).

View our article about Semiconductor Material Grades.

Custom Shapes and Cross Sections

Sealing products for the Semiconductor

Seals can be designed and manufactured to customer-specific, bespoke requirements, moulded in virtually any size, shape, and profile. For more information, see our Special Rubber Mouldings and Extrusions page.

If you require further information regarding our range of products and/or services, please contact a member of the team.

E & OE.