FOUP Door Seals

FOUP Door Seals For Semiconductor Applications

M Barnwell Services stands as one of the UK’s leading stockists and distributors of FOUP Door Seals which are meticulously crafted to fulfill the requirements of the Semiconductor industry. With over £5.1 million in stock, we serve over 5000 global customers with swift and dependable deliveries.

Our proficient team manages the entire production process, from prototyping and testing to final part manufacturing. Additionally, we offer specialised certification upon request and have industry-leading lead times.

If you would like more information about our range visit the Semiconductor Overview Products page or contact a team member.

Crafted to securely contain silicon wafers within a controlled environment, FOUPs (Front Opening Unified Pods or Front Opening Universal Pods) ensure protection. The primary aim of a wafer carrier is to ensure secure transit, docking, loading/unloading, storage, and upkeep of cleanliness.

Key Attributes of FOUP Door Seals

• Contamination Prevention: Block particles and contaminants, safeguarding enclosed wafers.
• Environmental Control: Maintain stable conditions for temperature, humidity, and cleanliness.
• Durability and Fit: Long-lasting and designed for precise fit.
• Process Efficiency: Enhance efficiency by ensuring quality and reliability in semiconductor manufacturing.
• Customisation: Involves tailoring to specific FOUP designs and cleanroom needs, ensuring peak performance across various applications.

Shapes and Sizes

FOUP door seals come in various sizes to accommodate different FOUP designs and configurations. The specific sizes can vary based on the FOUP model and semiconductor manufacturing requirements.

In general, the design of FOUP door seals aims to match the exact dimensions of the FOUP’s door opening, ensuring a precise and efficient seal.

FOUP Door Seal Materials

Materials that combine chemical resistance, durability, and effective sealing, meeting semiconductor manufacturing demands are frequently employed for FOUP door seals. Common materials used include:

• Fluorocarbon Elastomers (FKM/Viton™):
  These materials provide excellent chemical resistance, high-temperature stability, and good sealing properties. They are suitable for environments with exposure to aggressive chemicals and elevated temperatures.
• Perfluoroelastomers (FFKM/Kalrez®):
  FFKM materials offer exceptional chemical and thermal resistance, making them suitable for the harshest semiconductor manufacturing conditions where exposure to corrosive chemicals and high temperatures is prevalent.
• Silicone Elastomers:
  Silicone materials are recognised for their flexibility, ability to withstand low temperatures and compatibility with cleanroom settings. They find widespread application in scenarios demanding a blend of efficient sealing and adaptability to varying temperatures.
• Nitrile Rubber (NBR):
  Nitrile rubber offers good resistance to oils and moderate chemical exposure. In environments with lower aggressiveness and where high-temperature resistance holds less significance, it can find utilisation.
• Ethylene Propylene Diene Monomer (EPDM):
  EPDM materials offer good weather and temperature resistance, making them suitable for applications with less stringent chemical exposure and temperature requirements.
• Customised Blends:
  Manufacturers might provide tailored elastomer blends optimised for sealing performance, chemical resistance, and durability, based on the distinct FOUP designs and operational requirements.

It’s important to select the most appropriate material based on the cleanroom environment, chemicals used, temperature conditions, and other relevant factors for your semiconductor manufacturing processes.

Applications by Industry

• Semiconductor Manufacturing
  – Wafer Fabrication: Essential in semiconductor cleanrooms to maintain the controlled environment required for wafer fabrication processes, such as lithography, etching, and deposition.
• Electronics Manufacturing
  – Microelectronics Assembly:  Used in cleanrooms for the assembly and packaging of microelectronic components, ensuring contamination-free conditions.
• Photonics
  – Optoelectronics: In cleanrooms for optoelectronic component manufacturing, FOUP door seals help prevent contaminants from affecting the performance of optical devices like lasers and photodetectors.
• Biotechnology and Pharmaceutical
  – Cleanroom Laboratories:  Maintain sterile environments for research and development in biotechnology and pharmaceuticals, preventing contamination of sensitive samples and equipment.
• Aerospace and Defence
  – Precision Components: Assist in producing precision components that demand controlled environments to ensure reliability and performance.

You Are In Safe Hands

Being a reliable supplier to prominent global OEM manufacturing firms, M Barnwell Services is dedicated to delivering top-notch products and an exceptional, if not unparalleled, level of service.

Possessing a sealing inventory exceeding £5.1 million and backed by five strategically positioned branches across the UK, we are ideally positioned to cater to your needs and aspire to surpass your anticipations.

To see how our FOUP seals perform, read our FOUP Door Seals case study, and for further details about our offerings, access our catalogue or contact a member of the team. E&OE